Meyer Burger Technology Ltd today announced that it has received an important contract from JA Solar for its diamond wire based silicon wafer cutting technologies and industrially proven upgrade technologies for the manufacture of solar cells. The contract includes the delivery, installation and commissioning of the MAiA 2.1 system platform with the mass production scalable MB PERC technology and SiNA cell coating equipment as well as the DW288 diamond wire cutting technology for the production of its mono-crystalline silicon solar wafers.
JA Solar plans to expand its production volume of solar cells to support its increasing delivery of solar modules in national and international PV markets. With its DW288 cutting technology and MAiA and SiNA cell production platforms, Meyer Burger will be able to support JA Solar to increase the efficiency and quality of its existing solar wafer and cell production lines. The total annual output of the newly installed equipment will be approximately 1.5GW. Delivery and commissioning of the equipment is scheduled in the second half of 2016.