Cell Type: | Monocrystalline |
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Power Range: | 3.872~4.3 Wp |
Region: | China |
Model No. |
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Product Characteristics | |||||||||||
Cell Technology | Monocrystalline | ||||||||||
Dimensions | 156×156 mm | ||||||||||
Diagonal | 200±0.5 mm | ||||||||||
Cell Thickness | 1800/200 ± 20 µm | ||||||||||
Front Surface (-) | |||||||||||
No. of Busbars | 2 | ||||||||||
Busbar Width | 1.8 mm | ||||||||||
Busbar Material | Silver | ||||||||||
Anti Reflection Coating | Silicon nitride | ||||||||||
Back Surface (+) | |||||||||||
No. of Soldering Pads | 2 | ||||||||||
Soldering Pad Width | 4 mm | ||||||||||
Soldering Pad Material | Silver | ||||||||||
Back Surface Field (BSF) | Aluminium | ||||||||||
Electrical Data at STC | |||||||||||
Maximum Power (Pmax) |
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Voltage at Maximum Power Point (Vmpp) |
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Current at Maximum Power Point (Impp) |
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Open Circuit Voltage (Voc) |
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Short Circuit Current (Isc) |
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Cell Efficiency |
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Fill Factor (FF) |
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Thermal Ratings | |||||||||||
Temperature Coefficient of Pmax | -0.35 %/˚C | ||||||||||
Temperature Coefficient of Voc | -0.42 %/˚C | ||||||||||
Temperature Coefficient of Isc | 0.06 %/˚C |