Solar Cells
(465 Solar Cell Series / 4,932 Individual Solar Cells)

• Advanced TOPCon technology for higher efficiency

• Improved passivation and doping reduce power loss

• 16 busbars for better light capture

• Excellent low-light performance

• Very low light-induced degradation (LID)

• High weather resistance and durability

• Stable sealed power output

1. Superior Anti-PID performance

2. Low CTM Loss Rate,more suitable for high-power module

3. High bifaciality,relative conversion efficiency ≥92% under low light(200W/m²)

4. High cell conversion efficiency,front efficiency≥25.5%,Bifacial rate≥80%

5. Low decay and Low LID rate

6. Excellent mechanical characteristics

● Positive power tolerance of 0~3% improves system performance

● Industry leading Module efficiency: Max efficiency 22%

● Tested up to 5400 Pa for Maximum load resistance

● Verified resistance against PID effects

● Progressive Power warranty guarantees 80.2% of rated power at 25 Years

● Manufactured globally with world-class quality standards

• High Efficiency N-Type and TOPCon technologies

• Improved passivation and doping for lower power loss

• Ultra-large 210 mm wafers deliver Increased power density

• 16 busbars for better light capture

• Excellent low-light performance

• Very low light-induced degradation

• High weather resistance

● High Conversion Efficiencies Resulting in Superior Power Output Performance

● Outstanding Power Output Even in Low Light or High Temperature Conditions

● Optimized Design for Ease of Soldering and Lamination

● Long-term Stability, Reliability and Performance

● Low Breakage Rate

● Uniform Color

1. Superior Anti-PID performance

2. Low CTM Loss Rate,more suitable for high-power module

3. High bifaciality,relative conversion efficiency ≥92% under low light(200W/m²)

4. High cell conversion efficiency,front efficiency≥25.4%,Bifacial rate≥80%

5. Low decay and Low LID rate

6. Excellent mechanical characteristics

• High Performance N-Type and TOPCon technologies

• Improved passivation and doping minimize power loss

• Ultra-large 210 mm wafers deliver higher power density

• 18 busbars for better light capture

• Excellent low-light performance

• Very low light-induced degradation

• High weather resistance

1. Superior Anti-PID performance

2. Low CTM Loss Rate,more suitable for high-power module

3. High bifaciality,relative conversion efficiency ≥92% under low light(200W/m²)

4. High cell conversion efficiency,front efficiency≥25.5%,Bifacial rate≥80%

5. Low decay and Low LID rate

6. Excellent mechanical characteristics

• PERC plus SE Technology

• Higher efficiency to reach a maximum of 23.6%

• Uniform color on the front and back sides

1. High conversion efficiencies resulting in superior power output performance

2. Outstanding power output even in low light or high-temperature conditions

3. Optimized design for ease of soldering and lamination

4. Long-term stability, reliability and performance

5. Low breakage rate

6. Uniform color

· The accuracy of efficiency test is controlled within ±0.1%.

· Electrical performance, appearance, EL 100% automatic inspection.

• HJT 2.0 Technology

• -0.26%/°C Pmax temperature coefficient

• SMBB design with Half-Cut Technology

• Up to 90% Bifaciality

• Sealing with PIB-based sealant

High Efficiency 20%-23%

Wind/Snow Load 2400Pa/5400Pa

Lower temperature coefficient and operating temperature -40~+85°C

0~+5 Power Output Tolerance

Resistant to harsh environments such as salt, ammonia, sand, high temperature and high humidity areas

• SGS Certification for SNP Technology Cells

• Your Genuine SNP Technology Manufacturing Expert

• Dun & Bradstreet 5AA1 High Rating: We proudly hold a high 5AA1 rating from Dun & Bradstreet

• Lower Temperature Coefficient: Our products feature a lower temperature coefficient

• Bifaciality Over 85%: Achieve exceptional bifaciality, exceeding 85%

1. High conversion efficiencies resulting in superior power output performance

2. Outstanding power output even in low light or high temperature conditions

3. Optimized design for ease of soldering and lamination

4. Long-term stability, reliability and performance

5. Low breakage rate

• High Efficiency

• Lower Heat Spot Risk

• Excellent Low-light Performance

• 0-3% Power Tolerance

• PID Resistant

• Resilient to Extreme Weather