| Model No. |
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| Cell Technology | Bifacial | |||||||||||
| Dimensions | 210x210 mm | |||||||||||
| Diagonal | 295±0.25 mm | |||||||||||
| Cell Thickness | 170 ± 20 µm | |||||||||||
| No. of Busbars | 12 | |||||||||||
| Busbar Width | 0.06±0.03 mm | |||||||||||
| Anti Reflection Coating | Silicon nitride | |||||||||||
| No. of Soldering Pads | 12 | |||||||||||
| Soldering Pad Width | 0.06±0.03 mm | |||||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.32 %/˚C | |||||||||||
| Temperature Coefficient of Voc | -0.25 %/˚C | |||||||||||
| Temperature Coefficient of Isc | 0.045 %/˚C | |||||||||||
| Download Manufacturer's PDF | ||||||||||||