| Model No. |
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| Cell Technology | Bifacial | |||||||||||
| Dimensions | 182x183.75 mm | |||||||||||
| Diagonal | 256±0.25 mm | |||||||||||
| Cell Thickness | 170 ± 17 µm | |||||||||||
| No. of Busbars | 10 | |||||||||||
| Busbar Width | 0.06±0.015 mm | |||||||||||
| Anti Reflection Coating | Silicon nitride | |||||||||||
| No. of Soldering Pads | 10 | |||||||||||
| Soldering Pad Width | 1.1±0.15 mm | |||||||||||
| Soldering Pad Material | Aluminium | |||||||||||
| Back Surface Field (BSF) | Aluminium | |||||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.48 %/˚C | |||||||||||
| Temperature Coefficient of Voc | -0.32 %/˚C | |||||||||||
| Temperature Coefficient of Isc | 0.05 %/˚C | |||||||||||
| Intensity Dependence |
Intensity
Voc
Vmpp
1000 W/m2
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| Download Manufacturer's PDF | ||||||||||||