| Model No. |
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|---|---|---|---|---|---|---|---|---|---|---|---|
| Cell Technology | Monocrystalline | ||||||||||
| Cell Thickness | 200 ± 20 µm | ||||||||||
| No. of Busbars | 5 | ||||||||||
| Busbar Width | 0.7±0.1 mm | ||||||||||
| Busbar Material | Silver | ||||||||||
| Anti Reflection Coating | Silicon nitride | ||||||||||
| No. of Soldering Pads | 5 | ||||||||||
| Soldering Pad Width | 1.8 mm | ||||||||||
| Soldering Pad Material | Silver | ||||||||||
| Back Surface Field (BSF) | Aluminium | ||||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.38 %/˚C | ||||||||||
| Temperature Coefficient of Voc | -0.36 %/˚C | ||||||||||
| Temperature Coefficient of Isc | 0.07 %/˚C | ||||||||||
| Intensity Dependence |
Intensity
Voc
Vmpp
1000 W/m2
1
--
900 W/m2
0.996
--
800 W/m2
0.991
--
600 W/m2
0.988
--
400 W/m2
0.962
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| Download Manufacturer's PDF | |||||||||||