| Model No. |
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| Cell Technology | Polycrystalline | ||||||||
| Dimensions | 156×156 mm | ||||||||
| Cell Thickness | 200 ± 30 µm | ||||||||
| No. of Busbars | 3 | ||||||||
| Busbar Width | 1.5 mm | ||||||||
| Busbar Material | Silver | ||||||||
| Anti Reflection Coating | Silicon nitride | ||||||||
| No. of Soldering Pads | 3 | ||||||||
| Soldering Pad Width | 3 mm | ||||||||
| Soldering Pad Material | Silver, Aluminium | ||||||||
| Back Surface Field (BSF) | Aluminium | ||||||||
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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