| Model No. |
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| Cell Technology | PERC | |||||||||||
| Dimensions | 166×166 mm | |||||||||||
| Cell Thickness | 190 ± 20 µm | |||||||||||
| No. of Busbars | 6 | |||||||||||
| Busbar Width | 0.5 mm | |||||||||||
| Busbar Material | Silver | |||||||||||
| Anti Reflection Coating | Silicon nitride | |||||||||||
| No. of Soldering Pads | 6 | |||||||||||
| Soldering Pad Width | 1.5 mm | |||||||||||
| Soldering Pad Material | Silver, Aluminium | |||||||||||
| Back Surface Field (BSF) | Aluminium | |||||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.4 %/˚C | |||||||||||
| Temperature Coefficient of Voc | -0.2 %/˚C | |||||||||||
| Temperature Coefficient of Isc | 3.7 %/˚C | |||||||||||
| Download Manufacturer's PDF | ||||||||||||