| Model No. |
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| Cell Technology | Bifacial | ||||||||
| Dimensions | 166×166 mm | ||||||||
| Diagonal | 223±0.25 mm | ||||||||
| Cell Thickness | 175 ± 18 µm | ||||||||
| No. of Busbars | 9 | ||||||||
| Busbar Width | 0.08±0.02 mm | ||||||||
| Busbar Material | Silver | ||||||||
| No. of Soldering Pads | 9 | ||||||||
| Soldering Pad Width | 1.4±0.3 mm | ||||||||
| Soldering Pad Material | Aluminium | ||||||||
| Back Surface Field (BSF) | Aluminium | ||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.46 %/˚C | ||||||||
| Temperature Coefficient of Voc | -0.346 %/˚C | ||||||||
| Temperature Coefficient of Isc | 0.036 %/˚C | ||||||||