Cell Type: | TOPCon |
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Power Range: | 9.638 Wp |
Region: | China |
Model No. |
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Product Characteristics | ||
Cell Technology | TOPCon | |
Dimensions | 210x210 mm | |
Diagonal | 272±5 mm | |
Cell Thickness | 130 µm | |
Front Surface (-) | ||
Busbar Width | 0.03±0.025 mm | |
Busbar Material | Silver | |
Anti Reflection Coating | Titanium dioxide | |
Back Surface (+) | ||
No. of Soldering Pads | 12 | |
Soldering Pad Width | 0.8±0.025 mm | |
Soldering Pad Material | Silver | |
Back Surface Field (BSF) | Aluminium | |
Electrical Data at STC | ||
Maximum Power (Pmax) |
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Voltage at Maximum Power Point (Vmpp) |
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Current at Maximum Power Point (Impp) |
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Open Circuit Voltage (Voc) |
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Short Circuit Current (Isc) |
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Cell Efficiency |
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Fill Factor (FF) |
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Thermal Ratings | ||
Temperature Coefficient of Pmax | -0.25 %/˚C | |
Temperature Coefficient of Voc | -0.3 %/˚C | |
Temperature Coefficient of Isc | 0.045 %/˚C |