180-Mono-10BB-PID
Renesola Co., Ltd.
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Price per Piece
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| Minimum Order | 200000+ Pcs |
| M210R-N TYPE 16BB TOPCon | €0.761 |
85.68 %
24.5 ~ 26.0 %
TOPCon
9.93 Wp
182x210 mm
130 µm
16
Fill Factor
80.02 - 81.46 %
Cell Efficiency
22.4 - 23.2 %
Technology
Monocrystalline
Power Range
7.4 - 7.66 Wp
Region
China
Dimension
182x182 mm
Cell Thickness
150 ± 20 µm
No. of Busbars
10
Busbar Width
0.06±0.03 mm
No. of Soldering Pads
10
Soldering Pad Width
1.2±0.3 mm
Soldering Pad Material
Silver
Product Characteristics
| Model No. |
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|---|---|---|---|---|---|---|---|---|---|---|
| Cell Technology | Monocrystalline | |||||||||
| Dimensions | 182x182 mm | |||||||||
| Cell Thickness | 150 ± 20 µm | |||||||||
| No. of Busbars | 10 | |||||||||
| Busbar Width | 0.06±0.03 mm | |||||||||
| Busbar Material | Silver | |||||||||
| Anti Reflection Coating | Silicon nitride | |||||||||
| No. of Soldering Pads | 10 | |||||||||
| Soldering Pad Width | 1.2±0.3 mm | |||||||||
| Soldering Pad Material | Silver | |||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.38 %/˚C | |||||||||
| Temperature Coefficient of Voc | -0.36 %/˚C | |||||||||
| Temperature Coefficient of Isc | 0.07 %/˚C | |||||||||
| Intensity Dependence |
Intensity
Voc
Vmpp
1000 W/m2
1
--
900 W/m2
0.996
--
800 W/m2
0.991
--
600 W/m2
0.988
--
400 W/m2
0.962
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| Download Manufacturer's PDF | ||||||||||
Renesola Co., Ltd.
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