| Model No. |
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| Cell Technology | PERC | ||||||||||
| Dimensions | 210x210 mm | ||||||||||
| Diagonal | 296±0.5 mm | ||||||||||
| Cell Thickness | 160 ± 20 µm | ||||||||||
| No. of Busbars | 12 | ||||||||||
| Busbar Width | 0.06±0.04 mm | ||||||||||
| Busbar Material | Silver | ||||||||||
| Anti Reflection Coating | Silicon nitride | ||||||||||
| No. of Soldering Pads | 12 | ||||||||||
| Soldering Pad Width | 2.12±0.4 mm | ||||||||||
| Soldering Pad Material | Silver | ||||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.38 %/˚C | ||||||||||
| Temperature Coefficient of Voc | -0.36 %/˚C | ||||||||||
| Temperature Coefficient of Isc | 0.07 %/˚C | ||||||||||