| Model No. |
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| Cell Technology | PERC | |||||||||
| Dimensions | 158.75×158.75 mm | |||||||||
| Cell Thickness | 190 ± 30 µm | |||||||||
| No. of Busbars | 5 | |||||||||
| Busbar Width | 0.7 mm | |||||||||
| Busbar Material | Silver | |||||||||
| Anti Reflection Coating | Silicon nitride | |||||||||
| No. of Soldering Pads | 5 | |||||||||
| Soldering Pad Width | 1.8 mm | |||||||||
| Soldering Pad Material | Silver | |||||||||
| Back Surface Field (BSF) | Aluminium | |||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.38 %/˚C | |||||||||
| Temperature Coefficient of Voc | -0.36 %/˚C | |||||||||
| Temperature Coefficient of Isc | 0.07 %/˚C | |||||||||
| Download Manufacturer's PDF | ||||||||||