| Model No. |
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| Cell Technology | HJT | ||||
| Dimensions | 210x105 mm | ||||
| Cell Thickness | 110 ± 20 µm | ||||
| No. of Busbars | 20 | ||||
| Busbar Material | Silver | ||||
| No. of Soldering Pads | 20 | ||||
| Soldering Pad Material | Silver | ||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.24 %/˚C | ||||
| Temperature Coefficient of Voc | -0.22 %/˚C | ||||
| Temperature Coefficient of Isc | 0.04 %/˚C | ||||
| Download Manufacturer's PDF | |||||