| Model No. |
|
||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Cell Technology | PERC | ||||||||||
| Dimensions | 182x182 mm | ||||||||||
| Cell Thickness | 175 ± 17.5 µm | ||||||||||
| No. of Busbars | 10 | ||||||||||
| Busbar Width | 0.06±0.03 mm | ||||||||||
| Anti Reflection Coating | Silicon nitride | ||||||||||
| No. of Soldering Pads | 10 | ||||||||||
| Soldering Pad Width | 1.2±0.3 mm | ||||||||||
| Soldering Pad Material | Silver | ||||||||||
| Maximum Power (Pmax) |
|
||||||||||
| Voltage at Maximum Power Point (Vmpp) |
|
||||||||||
| Current at Maximum Power Point (Impp) |
|
||||||||||
| Open Circuit Voltage (Voc) |
|
||||||||||
| Short Circuit Current (Isc) |
|
||||||||||
| Cell Efficiency |
|
||||||||||
| Fill Factor (FF) |
|
||||||||||