| Model No. |
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| Cell Technology | TOPCon | ||||||||||
| Dimensions | 182x210 mm | ||||||||||
| Diagonal | 272±0.5 mm | ||||||||||
| Cell Thickness | 135 ± 13.5 µm | ||||||||||
| Busbar Width | 1.2±0.3 mm | ||||||||||
| Soldering Pad Width | 1.2±0.3 mm | ||||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.3 %/˚C | ||||||||||
| Temperature Coefficient of Voc | -0.26 %/˚C | ||||||||||
| Temperature Coefficient of Isc | 0.046 %/˚C | ||||||||||
| Download Manufacturer's PDF | |||||||||||