| Model No. |
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| Cell Technology | Monocrystalline | ||||||
| Dimensions | 156×156 mm | ||||||
| Cell Thickness | 180/200 µm | ||||||
| No. of Busbars | 3 | ||||||
| Busbar Width | 1.5 mm | ||||||
| Busbar Material | Silver | ||||||
| Anti Reflection Coating | Silicon nitride | ||||||
| No. of Soldering Pads | 3 | ||||||
| Soldering Pad Width | 2.1 mm | ||||||
| Soldering Pad Material | Silver, Aluminium | ||||||
| Back Surface Field (BSF) | Aluminium | ||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.44 %/˚C | ||||||
| Temperature Coefficient of Voc | -0.33 %/˚C | ||||||
| Download Manufacturer's PDF | |||||||