BTMSC
Benya Technology Group Co., Ltd
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Price per Piece
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| Minimum Order | 160+ Pcs |
| Lead Time | 1 days |
| LWNM18BB-G12-11.16W | €0.384 |
80.47 ~ 85.35 %
21.5 ~ 26.10 %
TOPCon
5.42 ~ 11.51 Wp
210x210 mm
130 µm
18
0.05±0.035 mm
18
0.05±0.035 mm
Silver
Cell Efficiency
15 - 20.1 %
Technology
Monocrystalline
Power Range
2.32 - 4.91 Wp
Region
China
Dimension
156.75×156.75 mm
Cell Thickness
180/200 ± 20 µm
No. of Busbars
4
Busbar Width
1.8 mm
No. of Soldering Pads
3
Soldering Pad Width
3 mm
Soldering Pad Material
Silver, Aluminium
Product Characteristics
| Model No. |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cell Technology | Monocrystalline | ||||||||||||||||||||
| Dimensions | 156.75×156.75 mm | ||||||||||||||||||||
| Diagonal | 165±0.5 mm | ||||||||||||||||||||
| Cell Thickness | 180/200 ± 20 µm | ||||||||||||||||||||
| No. of Busbars | 4 | ||||||||||||||||||||
| Busbar Width | 1.8 mm | ||||||||||||||||||||
| Busbar Material | Silver | ||||||||||||||||||||
| Anti Reflection Coating | Silicon nitride | ||||||||||||||||||||
| No. of Soldering Pads | 3 | ||||||||||||||||||||
| Soldering Pad Width | 3 mm | ||||||||||||||||||||
| Soldering Pad Material | Silver, Aluminium | ||||||||||||||||||||
| Back Surface Field (BSF) | Aluminium | ||||||||||||||||||||
| Maximum Power (Pmax) |
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| Cell Efficiency |
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