Material Types
Polysilicon, TPE Back Sheet, Copper, Cadmium Sulfide, Sputtering Target, Diethyl Zinc, Alumina, Polyolefin Back Sheet, BBF Back Sheet, Indium, Aluminium Back-Contact BackSheet, Copper Back-Contact BackSheet, TPT Back Sheet, KPK Back Sheet, PET Back Sheet, POE, Frame, Gallium, Molybdenum, Aluminium Cable, KPE Back Sheet, TPE Back Sheet, KPK Back Sheet, Copper Back-Contact BackSheet, TPT Back Sheet, Polyolefin Back Sheet, BBF Back Sheet, PVB, Phosphorus-oxychloride, Encapsulants, POE, Zinc Oxide, Selenium, Tin Oxide, Tellurium, Tin, EVA, Copper Cable, Seed Crystal, Recycled Cutting Liquid, Hydrochloric Acid, Ingot Mounting Adhesives, Saw Wire, SiC, Green SiC, Cutting Liquid, Monocrystalline Ingot, Nitric Acid, Polycrystalline Ingot, Graphite Felt, Carbon Felt, Ceramic Crucible, Quartz Crucible, Broken Cell, Broken Wafer, Hydrofluoric Acid, Monocrystalline Wafer, Silicon Junction Box, Other for crystaline panel, Connector, TCO Coated Glass, Ultra Clear Patterned Glass, Copper Ribbon, Lead Ribbon, Silicone Rubber Gasket, Switch, Polycrystalline Wafer, Cell, Sodium Hydroxide, Potassium Hydroxide, Nitric Acid, Hydrochloric Acid, Ammonia, Isopropyl Alcohol, Aluminium Back-Contact BackSheet