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Meyer Burger Receives Diamond Wire Saws Contract from Asian Customer

Published on 7 Jun 2016
Meyer Burger 
Meyer Burger Technology Ltd today announced that it has received an important contract from a manufacturer of mono-crystalline solar wafers in Asia for its new generation DW288 Series 3 diamond wire based silicon wafer cutting equipment. The customer plans to expand its production volume of mono-crystalline wafers to support the increasing demand for its high quality solar wafers. The contract value is over CHF 10 million. Delivery and commissioning of the systems is scheduled for the second half of 2016.

With its newest generation of its diamond wire cutting technology, Meyer Burger continues to reduce manufacturing costs for solar wafers.

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