| Model No. |
|
|
|---|---|---|
| Cell Technology | PERC | |
| Dimensions | 182x182 mm | |
| Diagonal | 247.2183±0.5 mm | |
| Cell Thickness | 175/17.5 µm | |
| No. of Busbars | 12 | |
| Busbar Width | 0.08±0.15 mm | |
| Busbar Material | Silver | |
| Anti Reflection Coating | Silicon nitride | |
| No. of Soldering Pads | 12 | |
| Soldering Pad Width | 1.7±0.3 mm | |
| Soldering Pad Material | Silver | |
| Back Surface Field (BSF) | Aluminium | |
| Maximum Power (Pmax) |
|
|
| Voltage at Maximum Power Point (Vmpp) |
|
|
| Current at Maximum Power Point (Impp) |
|
|
| Open Circuit Voltage (Voc) |
|
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| Short Circuit Current (Isc) |
|
|
| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.3 %/˚C | |
| Temperature Coefficient of Voc | 0.06 %/˚C | |
| Temperature Coefficient of Isc | -0.39 %/˚C | |