Cell Type: | TOPCon |
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Power Range: | -- |
Region: | China |
Model No. |
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Product Characteristics | ||
Cell Technology | TOPCon | |
Dimensions | 182x182 mm | |
Cell Thickness | 180 ± 30 µm | |
Front Surface (-) | ||
Busbar Width | 17.3±0.15 mm | |
Busbar Material | Silver | |
Anti Reflection Coating | Silicon nitride | |
Back Surface (+) | ||
Soldering Pad Width | 1.3±0.15 mm | |
Soldering Pad Material | Silver | |
Back Surface Field (BSF) | Aluminium | |
Electrical Data at STC | ||
Voltage at Maximum Power Point (Vmpp) |
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Current at Maximum Power Point (Impp) |
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Open Circuit Voltage (Voc) |
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Short Circuit Current (Isc) |
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Cell Efficiency |
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Fill Factor (FF) |
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