| Model No. |
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|---|---|---|---|---|---|---|---|---|
| Cell Technology | Monocrystalline | |||||||
| Dimensions | 125×125 mm | |||||||
| Diagonal | 200±0.5 mm | |||||||
| Cell Thickness | 200 ± 20 µm | |||||||
| No. of Busbars | 2 | |||||||
| Busbar Width | 1 mm | |||||||
| Busbar Material | Silver | |||||||
| Anti Reflection Coating | Silicon nitride | |||||||
| No. of Soldering Pads | 2 | |||||||
| Soldering Pad Width | 2.5 mm | |||||||
| Soldering Pad Material | Silver | |||||||
| Back Surface Field (BSF) | Aluminium | |||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.42 %/˚C | |||||||
| Temperature Coefficient of Voc | -0.329 %/˚C | |||||||
| Temperature Coefficient of Isc | 0.043 %/˚C | |||||||
| Intensity Dependence |
Intensity
Voc
Vmpp
1000 W/m2
1
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