| Model No. |
|
|||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cell Technology | TOPCon | |||||||||||
| Dimensions | 182x182 mm | |||||||||||
| Diagonal | 247±0.25 mm | |||||||||||
| Cell Thickness | 160 ± 16 µm | |||||||||||
| No. of Busbars | 16 | |||||||||||
| Busbar Width | 0.03±0.015 mm | |||||||||||
| Busbar Material | Silver | |||||||||||
| Anti Reflection Coating | Silicon nitride | |||||||||||
| No. of Soldering Pads | 16 | |||||||||||
| Soldering Pad Width | 0.03±0.015 mm | |||||||||||
| Soldering Pad Material | Silver | |||||||||||
| Maximum Power (Pmax) |
|
|||||||||||
| Voltage at Maximum Power Point (Vmpp) |
|
|||||||||||
| Current at Maximum Power Point (Impp) |
|
|||||||||||
| Open Circuit Voltage (Voc) |
|
|||||||||||
| Short Circuit Current (Isc) |
|
|||||||||||
| Cell Efficiency |
|
|||||||||||
| Fill Factor (FF) |
|
|||||||||||
| Temperature Coefficient of Pmax | -0.3 %/˚C | |||||||||||
| Temperature Coefficient of Voc | -0.25 %/˚C | |||||||||||
| Temperature Coefficient of Isc | 0.045 %/˚C | |||||||||||
| Intensity Dependence |
Intensity
Voc
Vmpp
1000 W/m2
1
--
800 W/m2
0.99
--
600 W/m2
0.98
--
400 W/m2
0.96
--
200 W/m2
0.93
--
|
|||||||||||