| Model No. |
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|---|---|---|---|---|---|---|---|---|---|
| Cell Technology | Bifacial | ||||||||
| Dimensions | 210x210 mm | ||||||||
| Cell Thickness | 175 ± 17.5 µm | ||||||||
| No. of Busbars | 12 | ||||||||
| Busbar Width | 0.09 mm | ||||||||
| Busbar Material | Silver | ||||||||
| Anti Reflection Coating | Silicon nitride | ||||||||
| No. of Soldering Pads | 12 | ||||||||
| Soldering Pad Width | 1.6±0.3 mm | ||||||||
| Soldering Pad Material | Silver | ||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.38 %/˚C | ||||||||
| Temperature Coefficient of Voc | -0.36 %/˚C | ||||||||
| Temperature Coefficient of Isc | 0.07 %/˚C | ||||||||
| Intensity Dependence |
Intensity
Voc
Vmpp
1000 W/m2
1
--
800 W/m2
0.99
--
600 W/m2
0.98
--
400 W/m2
0.96
--
200 W/m2
0.93
--
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