| Model No. |
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|---|---|---|---|---|---|---|---|---|---|---|
| Cell Technology | Back Contact | |||||||||
| Dimensions | 166×166 mm | |||||||||
| Diagonal | 223±0.5 mm | |||||||||
| Cell Thickness | 160 ± 20 µm | |||||||||
| No. of Busbars | 6 | |||||||||
| Anti Reflection Coating | Silicon nitride | |||||||||
| No. of Soldering Pads | 6 | |||||||||
| Soldering Pad Width | 0.8 mm | |||||||||
| Soldering Pad Material | Silver | |||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Temperature Coefficient of Pmax | -0.3 %/˚C | |||||||||
| Temperature Coefficient of Voc | -0.268 %/˚C | |||||||||
| Temperature Coefficient of Isc | 0.042 %/˚C | |||||||||
| Intensity Dependence |
Intensity
Voc
Vmpp
1000 W/m2
1
--
900 W/m2
0.994
--
500 W/m2
0.974
--
300 W/m2
0.951
--
200 W/m2
0.927
--
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