| Model No. |
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|---|---|---|---|---|---|---|---|---|---|---|
| Cell Technology | HJT | |||||||||
| Dimensions | 166×166 mm | |||||||||
| Cell Thickness | 140 ± 14 µm | |||||||||
| No. of Busbars | 12 | |||||||||
| Busbar Width | 0.02 mm | |||||||||
| Busbar Material | Silver | |||||||||
| No. of Soldering Pads | 12 | |||||||||
| Soldering Pad Width | 0.04 mm | |||||||||
| Soldering Pad Material | Silver | |||||||||
| Maximum Power (Pmax) |
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| Voltage at Maximum Power Point (Vmpp) |
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| Current at Maximum Power Point (Impp) |
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| Open Circuit Voltage (Voc) |
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| Short Circuit Current (Isc) |
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| Cell Efficiency |
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| Fill Factor (FF) |
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| Intensity Dependence |
Intensity
Voc
Vmpp
1000 W/m2
1
--
900 W/m2
0.996
--
800 W/m2
0.991
--
600 W/m2
0.988
--
400 W/m2
0.962
--
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