| Model No. |
|
||||||
|---|---|---|---|---|---|---|---|
| Cell Technology | PERC | ||||||
| Dimensions | 166×166 mm | ||||||
| Cell Thickness | 190 ± 30 µm | ||||||
| No. of Busbars | 9 | ||||||
| Busbar Width | 0.1±0.03 mm | ||||||
| Busbar Material | Silver | ||||||
| Anti Reflection Coating | Silicon nitride | ||||||
| No. of Soldering Pads | 9 | ||||||
| Soldering Pad Width | 1.3±0.25 mm | ||||||
| Soldering Pad Material | Silver | ||||||
| Back Surface Field (BSF) | Aluminium | ||||||
| Maximum Power (Pmax) |
|
||||||
| Voltage at Maximum Power Point (Vmpp) |
|
||||||
| Current at Maximum Power Point (Impp) |
|
||||||
| Open Circuit Voltage (Voc) |
|
||||||
| Short Circuit Current (Isc) |
|
||||||
| Cell Efficiency |
|
||||||
| Fill Factor (FF) |
|
||||||
| Temperature Coefficient of Pmax | -0.38 %/˚C | ||||||
| Temperature Coefficient of Voc | -0.36 %/˚C | ||||||
| Temperature Coefficient of Isc | 0.07 %/˚C | ||||||
| Download Manufacturer's PDF | |||||||